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AlSiC Products

IGBT Baseplates

IGBT Pin Fin Coolers

Our AlSiC products are used in a wide variety of applications around the globe. Each product we produce has high reliability with unique qualities, including compatible thermal expansion and high thermal conductivity, while maintaining a lightweight composition with high strength and stiffness.

 

Products can be designed to match custom specifications as well as standard formats and custom sizes.

 

Applications include IGBT module baseplates and coolers for traction, wind, solar and power generation, airborne electronics, power conversion, and hybrid electric and electric vehicles.

Hermetic Packages Products

Hermetic Packages

Our Hermetic Package Business designs and produces products that have high reliability and are used in applications such as military, aerospace, and telecommunications.

 

Similar to AlSiC, each product can be designed to match custom specifications as well as standard formats and custom sizes.

 

Each hermetic package is hermetically sealed with a thermal expansion matched seal by using a "Two Step Sealing Process" to produce the most robust hermetic seal.

CPS also combines AlSiC material with hermetic packages to develop a product that has certain advantages in comparison to other hermetic packages. Including high thermal conductivity, 40-60% lighter weight, readily available material, and thermal expansion matching for direct attachment of substrates.

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