ARTICLES

Consider Your Materials Carefully In Microprocessor And ASIC Design

 

By M.A. Occhionero in Electronic Design 


Read the recent article titled 'AlSiC Microprocessor Lids Handle the Heat' in SMT by M.A. Occhionero

 

Richard W. Adams and Mark Occhionero, "AlSiC-Based Hybrid Composite Tool Kit" PowerPoint Presentation presented at New England IMAPS 31 Annual Symposium, Boxboro MA, May 6 2004.

 

Mark A. Occhionero, Richard W. Adams, and Dave Saums, "AlSiC for Optoelectronic Thermal Management and Packaging Designs"

 

Mark A. Occhionero, Richard W. Adams, Kevin P. Fennessy,and Glenn Sundberg, "AlSiC Baseplates for Power IGBT Modules: Design, Performance and Reliability"

 

Mark A. Occhionero, Robert A. Hay, Richard W. Adams, and Kevin P. Fennessy, "Aluminum Silicon Carbide (AlSiC) Microprocessor Lids and Heat Sinks for Integrated Thermal Management Solutions" presented at the 2000 HDI Conference in Denver Colorado April 25 - 28th [Acrobat PDF Format]..

 

Mark A. Occhionero, Robert A. Hay, Richard W. Adams, and Kevin P. Fennessy, "Aluminum Silicon Carbide (AlSiC) For Cost-Effective Thermal Management And Functional Microelectronic Packaging Design Solutions" 12th European Microelectronics and Packaging Conference, June 7 -9 1999, S10-04. [Acrobat PDF Format].

 

M.A. Occhionero, R.A. Hay, R.W. Adams, and K.P. Fennessy (Ceramics Process Systems) and W. Becker, T. Fletcher, and L. Brasier, (Raytheon Systems Dallas TX) "Aluminum Silicon Carbide (AlSiC) Waveguide Substrate for Commercial Communications Application: A Case Study" proceedings of the 26th Annual IMAPS NE Symposium, Andover MA , (May 1999). [Acrobat PDF Format].

 

M.A. Occhionero, R.W. Adams, K.P. Fennessy, R.A. Hay, "Aluminum Silicon Carbide (AlSiC) Thermal Management Packaging For High Density Packaging Applications" proceedings for International Conference on High Density Packaging and MCM's (Denver, CO, April 6-9, 1999) [Acrobat PDF Format].

 

M.A. Occhionero, R.W. Adams, K.P. Fennessy, R.A. Hay, "Cost-Effective Manufacturing Of Aluminum Silicon Carbide (AlSiC) Electronic Packages" proceedings of the IMAPS Advanced Packaging Materials Symposium, (Braselton GA, March 14 - 17, 1999) [Acrobat PDF Format].

 

M.A. Occhionero, R.W. Adams, K.P. Fennessy, R.A. Hay, "Aluminum Silicon Carbide (AlSiC) for Thermal Management Solutions and Functional Packaging Designs" proceedings of the Annual IMAPS Conference, San Diego CA, (October 31 - November 4 1998) [326 KB Zipped Office 97 Word.Doc].

 

M.A. Occhionero, R.W. Adams, K.P. Fennessy, R.A. Hay,"Aluminum Silicon Carbide (AlSiC) for Advanced Microelectronic Packages" proceedings of the 25th Annual IMAPS NE Symposium, Andover MA (May 14, 1998): [Acrobat PDF Format]

 

M.A.Occhionero, R.W. Adams, K.P. Fennessy, "A New Substrate for Electronic Packaging: Aluminum Silicon Carbide (AlSiC) Composites," Proceedings of the Forth Annual Portable by Design Conference, Electronics Design, March 24-27, pp 398-403. [Acrobat PDF Format]

 

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