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AlSiC liquid cooled cold plates AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates, Advanced Thermal Dissipation |
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AlSiC products can be integrated with cooling tubes and hydraulic fittings during the AlSiC forming process. This process eliminates the need for secondary assembly and can be used for liquid cooling solutions, providing CTE compatibility, bulk material thermal conductivity, low material density and high strength. The picture at the left shows IR thermal image of AlSiC baseplate with integrated cooling tube. Below is shown an example of the practice of this patent with cooling tubes integrated within a microprocessor lid. The ultrasonic image that follows shows the serpentine pattern of the AlSiC encapsulated cooling tube.
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