CPS Technologies Corporation

AlSiC liquid cooled cold plates

AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates, Advanced Thermal Dissipation


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AlSiC Material Sheet
AlSiC Flip Chip Data Sheet 
AlSiC Design Sheet

CPS Technologies Corporation
formerly Ceramics Process Systems
111 South Worcester Street
Norton MA,  02766

voice (508) 222-0614

fax (508) 222-0220

e-mail

DUNS # 12-099-8661
CAGE Code 46613
certified to ISO 9001:2000 standard
 

update 051608

CPS Design Guideline Quick Reference (pdf format 505 KB)


NEWS: AlSiC for Hybrid Electric Vehicle Coolers
press release

IGBT Coolers for high power applications.  This product type integrates the cooler and the IGBT base plate in one product for improved thermal dissipation.  Hydraulic fittings were integrated during the material fabrication for a more robust cost-effective product.   AlSiC-9 is chosen for these applications since it supports the bonding of DBC dielectric ceramic substrates.

Read more about it. "AlSiC Baseplates for Power IGBT Modules: Design, Performance and Reliability"

CPS awarded patent December 30 2003 US 6,668,912 B2 for 'Heat Exchanger Cast in Metal Matrix Composites and Method of Making the Same.

CPS can incorporate pin fins in AlSiC power substrates for liquid cooled applications.  The above liquid cooled IGBT base product is about 10.25 inch (260 mm) long by 5.3 inches (135 mm) wide and over a 0.400 inches (10 mm) thick.  Pins in this liquid cooled IGBT base were cast during the pressure infiltration process.

CPS awarded patent December 30 2003 US 6,668,912 B2 for 'Heat Exchanger Cast in Metal Matrix Composites and Method of Making the Same.

AlSiC products can be integrated with cooling tubes and hydraulic fittings during the AlSiC forming process. This process eliminates the need for secondary assembly and can be used for liquid cooling solutions, providing CTE compatibility, bulk material thermal conductivity, low material density and high strength. The picture at the left shows IR thermal image of AlSiC baseplate with integrated cooling tube.

Below is shown an example of the practice of this patent with cooling tubes integrated within a microprocessor lid.

The ultrasonic image that follows shows the serpentine pattern of the AlSiC encapsulated cooling tube.