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AlSiC power substrates AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates, Advanced Thermal Dissipation |
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CPS makes a suite of thermal expansion matched AlSiC carriers for hybrid circuits used for power amplifiers and power supplies in cellular phone base stations. CPS has manufactured more than one million carriers for base stations around the world to date. In these applications AlSiC cost-competitively replaces Cu substrates. The result of the controlled CTE to match of assembled components is increased component reliability, ease of assembly and a dramatic drop in the cost of ownership of the base station units. AlSiC-9 is chosen for these applications since it supports the bonding of DBC dielectric ceramic substrates. Read more about it."Aluminum Silicon Carbide (AlSiC) for Thermal Management Solutions and Functional Packaging Designs"
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