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AlSiC optoelectronic housings AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates, Advanced Thermal Dissipation |
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The current trend in optoelectronics packaging is for smaller, more efficient, and cost-effective packaging designs that improve device manufacturability and reliability. AlSiC materials and packages provide designers solutions to the increased mechanical and thermal behavior performance requirements of today's optoelectronics systems. The CPS AlSiC net-shape fabrication process allows for the cost effective manufacturing of optoelectronic housings including design features such as septums, walls and radial features for alignment of optical connections. Note that the complex features of the AlSiC optoelectronic housing shown in the above picture are as-cast with no final machining. Controlled Thermal Expansion Meets Assembly Requirements In designing optoelectronic systems the designer must consider the application and operation of the optoelectronic module when designing the device package. Two types of optical module operating modes can be identified: 1) systems that must to be reliable over multiple thermal cycles (on/off); and 2) module systems that require highly efficient thermal dissipation to maintain a constant uniform low temperature value (~25-30°C). Thermal Cycling Applications For systems that require thermal cycling, the AlSiC package provides a high thermal conductivity value for effective heat dissipation and a material CTE value that is compatible with the CTE value of the functional device to reduce mechanical stresses during operation. For more information please read "AlSiC for Optoelectronic Thermal Management and Packaging Designs" Constant Temperature Applications
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For systems that require constant temperature operation
(e.g. laser diode substrates) the system needs to have high thermal conductivity
value and exceptional heat dissipation. High thermal dissipation improves
the efficiency of the die and thermoelectric cooler (TEC). AlSiC composite
systems can provide this high heat dissipation efficiency. For more
information please read