AlSiC CTE compatibility with device and assembly improve reliability by minimizing thermally induced cycling stresses.
Direct device attachment is possible with
AlSiC-9
- stress compensation materials are not necessary
- thermal dissipation is improved as assembly thermal resistance is decreased without stress compensation layers.
AlSiC has a good thermal conductivity for thermal
dissipation.
Direct device attachment is possible with
AlSiC-9
- stress compensation materials are not necessary
- thermal dissipation is improved as assembly thermal resistance is decreased without stress compensation layers.
AlSiC material is light weigh making it ideal for weight sensitive applications
AlSiC is 1/3 the weight of Cu or Steel
AlSiC is 1/5 the weight of CuMo
AlSiC is 1/6 the weight of CuW
AlSiC's light weight coupled with high strength and stiffness improves product assembly shock and vibration tolerance.
Lighter weigh high strength and stiffness materials are more shock and vibration tolerant
AlSiC cast shape capability allows for more functional lid
designs incorporating:
Net shape precision cast fabrication for cost effective serial production
Die cavities/pedestals
Alignment features
Allows for more functional designs
AlSiC offers good dimensional control
AlSiC is a dense and hermetic material
Provides environmental
protection having a hermeticity value of < 1 x 10-9
Atm-cm3/s He leak rate.