CPS Technologies Corporation

AlSiC microwave housings

AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates, Advanced Thermal Dissipation


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AlSiC Material Sheet
AlSiC Flip Chip Data Sheet 
AlSiC Design Sheet

CPS Technologies Corporation
formerly Ceramics Process Systems
111 South Worcester Street
Norton MA,  02766

voice (508) 222-0614

fax (508) 222-0220

e-mail

DUNS # 12-099-8661
CAGE Code 46613
certified to ISO 9001:2000 standard
 

update 051608

AlSiC provides an ideal material for microwave packaging applications. In fact CPS developed the AlSiC material and the net-shape manufacturing process for electronic packaging in 1987 for the Advance Microwave Packaging and Monolithic Microwave Module IC programs.

AlSiC CTE compatibility with assembly components  

AlSiC CTE compatibility with device and assembly improve reliability by minimizing thermally induced cycling stresses.  

Direct device attachment is possible with AlSiC-9

- stress compensation materials are not necessary

 - thermal dissipation is improved as assembly thermal resistance is decreased without stress compensation layers.

AlSiC has a good thermal conductivity for thermal dissipation.

Direct device attachment is possible with AlSiC-9

- stress compensation materials are not necessary

 - thermal dissipation is improved as assembly thermal resistance is decreased without stress compensation layers.

AlSiC material is light weigh making it ideal for weight sensitive applications

AlSiC is 1/3 the weight of Cu or Steel

AlSiC is 1/5 the weight of CuMo

AlSiC is 1/6 the weight of CuW

AlSiC's light weight coupled with  high strength and stiffness improves product assembly shock and vibration tolerance.

Lighter weigh high strength and stiffness materials  are more  shock and  vibration tolerant 

AlSiC cast shape capability allows for more functional lid designs incorporating:

Net shape precision cast fabrication for cost effective serial production

Die cavities/pedestals

Alignment features

Allows for more functional designs 

AlSiC offers good dimensional control 

AlSiC is a dense and hermetic material

Provides environmental protection having a hermeticity value of < 1 x 10-9  Atm-cm3/s He leak rate.



Below is a large AlSiC-9 composite component for a microwave phased array radar application that is approximately 12 inches (300 mm) in diameter and 3 inches (75 mm) in height.  It is important to note all the wall features that extend the depth of this product were as-cast (no post machining).

Below is a large AlSiC-9 composite lid that was fabricated for the above system.  Again features provided in this product were as-cast (no post machining).