|
|
AlSiC flip chip and microprocessor lids AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates, Advanced Thermal Dissipation |
||||||||||||||||||||||||||||||||||
|
|
AlSiC for Flip Chip Lid Applications
click and download the new AlSiC Flip Chip Lid data sheet AlSiC CTE compatibility with assembly components AlSiC CTE compatibility with device and assembly improve reliability by minimizing thermally induced cycling stresses Chose AlSiC-9 for Flip Chip microprocessor lids for ceramic BGA assemblies Chose AlSiC-10 or AlSiC-12 Flip Chip microprocessor lids for plastic BGA assemblies AlSiC has a good thermal conductivity for thermal dissipation. CTE compatibility allows closer device proximity to take advantage of the AlSiC lid's thermal conductivity AlSiC light weight improves product assemblies Reduces the weight per solder ball by 1/3 as compared to equivalent Cu lids. Lighter weigh lids reduce shock during assembly and vibration related failures in service Lighter weight lids are important for larger more functional lids for ‘Systems in Package’ ASICs AlSiC cast shape capability allows for more functional lid designs incorporating: Net shape precision cast fabrication for cost effective serial production Die cavities/pedestals Cavities for capacitors, diodes, memory chips Alignment features Allows for more functional designs in ‘System in Package’ ASIC assemblies AlSiC offers good control of cavity depth for improved control of bond line thickness. Thinner bond lines are possible for reduced thermal resistance with AlSiC lids AlSiC lids have less variability compared to stamped Cu lids or lidded ring frame assemblies AlSiC is a high strength and stiffness material allowing for higher assembly forces without damage to fragile die. Thinner bond lines are possible for reduced thermal resistance |
