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AlSiC thermal management materials AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates |
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The CPS AlSiC fabrication process not only produces the composite material but also fabricates the product geometry for a cost-efficient, highly manufacturable product. This process allows competitive pricing with other material choices while providing exceptional thermal management in a light-weight, high-strength, high-stiffness product. The CPS manufacturing capability is currently handling production volumes as few as tens of pieces to tens of thousands daily.
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CPS Aluminum Silicon Carbide (AlSiC) metal matrix composite
materials and products are designed to have a High Thermal Conductivity and
a Controlled Thermal Expansion behavior that will be compatible with your
application and assembly. The Coefficient of Thermal Expansion (CTE) of the
AlSiC composite is controlled and can be modified by the composition of Al-metal
and SiC-particulate. The AlSiC metal matrix thermal conductivity and
weight are similar to Al-metal, with controlled thermal expansion values
that can be 1/2 to 1/3 that of Al-metal depending upon your application and
need.
