CPS Technologies Corporation

vision

AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates, Advanced Thermal Dissipation


home
NEW Hermetic Package Home
manufacturing
vision
AlSiC materials
AlSiC thermal management
QuickSetTM injection molding
design
contacts
literature
news releases
shows and exhibits
AlSiC Material Sheet
AlSiC Flip Chip Data Sheet 
AlSiC Design Sheet

CPS Technologies Corporation
formerly Ceramics Process Systems
111 South Worcester Street
Norton MA,  02766

voice (508) 222-0614

fax (508) 222-0220

e-mail

DUNS # 12-099-8661
CAGE Code 46613
certified to ISO 9001:2000 standard
 

update 051608

copyright 2008


Are you interested in higher reliability? Improved performance?  Lower costs? Metal matrix composites can provide all these benefits to your applications. CPS is the World Leader in designing and manufacturing metal matrix composite components. Aluminum Silicon Carbide (AlSIC) is the primary  but not the only metal matrix composite we produce.

 Our vision is to enable our customers to reap the benefits of the superior properties of this class of materials.

We accomplish this vision by designing and manufacturing finished components on time, to exacting specifications, at low costs, and in the quantities you desire.

Share with us your needs and objectives; we will propose, design and manufacture the solutions for you.

Our fabrication process allows for rapid prototyping, rapid scale-up to production, novel designs and integration schemes for advanced thermal management solutions.

CPS design staff uses solidworks

CPS quality department

Our customers testify to our success in producing thermal management solutions to exact customer specifications in a time efficient development-to-production schedule.  From concept to component we design and machine all tooling in-house which allows us to control tolerance values for all critical features.

CPS AlSiC products are light-weight, high thermal conductivity components that have coefficient of thermal expansion (CTE) behavior compatible to the application. Our AlSiC materials are hermetic and compatible with numerous plating, soldering, and brazing processes.

lids with concurrently integrated feedthrusCPS uses a net-shape pressure casting process for AlSiC components that allows complex geometrical features to be incorporated without expensive machining. The CPS AlSiC casting process allows in-situ integration (termed "Concurrent Integration™") of very high thermal conductivity materials, such as cooling tubes and cooling cores for more Advanced Thermal Management Solutions.

assortment of flip chip lidsOur AlSiC products are manufactured in high volume for commercial microprocessor lid applications, commercial baseplate or carrier plate applications as well as numerous microwave radar and commercial communications systems.