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CPS
AlSiC products are light-weight, high thermal conductivity components that
have coefficient of thermal expansion (CTE) behavior compatible to the
application. Our AlSiC materials are hermetic and compatible with numerous
plating, soldering, and brazing processes.
CPS
uses a net-shape pressure casting process for AlSiC components that allows
complex geometrical features to be incorporated without expensive machining.
The CPS AlSiC casting process allows in-situ integration (termed "Concurrent
Integration™") of very high thermal conductivity materials, such as
cooling tubes and cooling cores for more Advanced Thermal Management Solutions.
Our AlSiC products
are manufactured in high volume for commercial microprocessor lid applications,
commercial baseplate or carrier plate applications as well as numerous microwave
radar and commercial communications systems.
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