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flipchip lids	optoelectronics	IGBT baseplates
microwave packaging	power substrates	coolers

CPS uses its net-shape fabrication process for high volume manufacturing of AlSiC components including flip-chip lids (microprocessor, heatsinks, flip-chip, DSP application), power applications (IGBT baseplate, power substrates), optoelectronic and microwave packaging.  Current production quantities can be as few as tens of pieces to tens of thousands daily.

AlSiC (Aluminum Silicon Carbide) metal matrix materials are ideal for electronics thermal management applications, having controlled thermal expansion (CTE) values that are compatible with electronic devices and assemblies, and high thermal conductivity values for excellent thermal dissipation. Additionally, AlSiC is lightweight, has high strength and stiffness and offers a high strength to weight ratio suitable for airborne, spaceborne or other weight applications.

CPS is a fully qualified supplier to most major OEMs.  Our manufacturing and quality systems and capabilities have been audited and approved by many of the most exacting customers in the world.  We ship to Asia, Europe, North America and throughout the world.

New product lead times are principally driven by a thorough design process and tool fabrication lead times. Typical time for delivery of new products is six to eight weeks. Development times will vary depending on product complexity and production queue.

CPS employs a highly trained manufacturing team integrating engineering, production, and quality personnel that are highly skilled in the development and operation of our rigorously documented processes:

• Design Engineering: Uses 3-D solid modeling to design customer products, and design the required molds/tools and fixtures. Product design is an important interactive step with customers to meet the needs and provide a product manufacturable by CPS's processes. All design steps rigorously follow our thorough ISO certified process.

• Tool and Die Works: Specialized skill and craftsmanship allows CPS to make in house all injection molding and casting tools as well as specialized fixtures, punch die sets and measurement fixtures. Injection molding tools can vary from "soft" tools with minimal actuation to hardened steel dies with automatic actuation.

• Injection Molding: Uses the patented, revolutionary QuickSet^TM injection molding process to rapidly manufacture high quality SiC preforms with highly repeatable pore structure and solids loading - critical to the consistency of the final AlSiC composite properties.

• Product Assembly: Using processes unique in the composites industry allows CPS a highly flexible process line that can handle low volumes of complex multi-component parts or high volumes of simpler parts. Readily scaleable to meet rapid and unforeseen demand increases. 

• Aluminum Infiltration Casting: Unique proprietary CPS QuickCast^TM process provides high volume manufacturing of high pressure infiltrated composites with tight dimensional tolerances. These can include particulate and fiber reinforced composites as well as precision components without reinforcement.

• Machining: CPS performs all finish machining where tight tolerances or features exceeding the capability of net-shape casting are needed. We are skilled in the use of common steel and carbide cutting tooling as well as PCD and coated diamond in areas where AlSiC itself must be machined. The machine shop utilizes state of the art inspection equipment including an automated CMM for in-process inspection and correlation with our QA department.

•  Finishing: Controls the quality of AlSiC surface finish that is functional for the end users applications: plating, laser marking, painting...

• Process Engineering: M.Sc. and Ph.D. engineers/scientists with over 30 years combined experience in materials and process development. Readily tackle unique product and process related challenges.

• Quality: In each employee's job description and in the way we train our employees, interact with customers, and run our business.  CPS's Quality System is world class and is certified to the ISO 9001:2000 standard.  Our quality system procedures are not covered with dust!  We have state of the art dimensional measurement equipment as well as characterization equipment including a dual pushrod dilatometer for CTE measurement and "scanning acoustic microscopy"

• Facility: Sufficient to meet your high volume needs.

Our manufacturing facility is located in Massachusetts approximately one hour South of Boston near the junctions of Routes 495 and 95 and is easily accessible 60 minute drive from either nearby Logan Airport in Boston, or TF Green in Providence Rhode Island.  Please come and see us.

AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates