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AlSiC provides an ideal material for microwave packaging applications. In fact CPS developed the AlSiC material and the net-shape manufacturing process for electronic packaging in 1987 for the Advance Microwave Packaging and Monolithic Microwave Module IC programs.
AlSiC CTE compatibility with device and assembly improve reliability by minimizing thermally induced cycling stresses.
Direct device attachment is possible with AlSiC-9
Lighter weight, high-strength, and stiffness materials are more shock and vibration tolerant
| AlSiC is a dense and hermetic material Provides environmental protection having a hermeticity value of < 1 x 10-9 Atm-cm3/s He leak rate. M3G DC/DC Converter for Space Applications:
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Right is a large AlSiC-9 composite component for a microwave phased array radar application that is approximately 12 inches (300 mm) in diameter and 3 inches (75 mm) in height. It is important to note all the wall features that extend the depth of this product were as-cast (no post machining). |
Right is a large AlSiC-9 composite lid that was fabricated for the above system. Again features provided in this product were as-cast (no post machining). |