AlSiC Coolers for Power Modules

IGBT Coolers for high power applications. This product type integrates the cooler and the IGBT base plate in one product for improved thermal dissipation. Hydraulic fittings were integrated during the material fabrication for a more robust cost-effective product. AlSiC-9 is chosen for these applications since it supports the bonding of DBC dielectric ceramic substrates.

Read more about it. "AlSiC Baseplates for Power IGBT Modules: Design, Performance and Reliability"

CPS awarded patent December 30 2003 US 6,668,912 B2 for 'Heat Exchanger Cast in Metal Matrix Composites and Method of Making the Same.

CPS can incorporate pin fins in AlSiC power substrates for liquid cooled applications. The above liquid cooled IGBT base product is about 10.25 inch (260 mm) long by 5.3 inches (135 mm) wide and over a 0.400 inches (10 mm) thick. Pins in this liquid cooled IGBT base were cast during the pressure infiltration process.

CPS awarded patent December 30 2003 US 6,668,912 B2 for 'Heat Exchanger Cast in Metal Matrix Composites and Method of Making the Same.

AlSiC products can be integrated with cooling tubes and hydraulic fittings during the AlSiC forming process. This process eliminates the need for secondary assembly and can be used for liquid cooling solutions, providing CTE compatibility, bulk material thermal conductivity, low material density and high strength. The picture at the left shows IR thermal image of AlSiC baseplate with integrated cooling tube.

Below is shown an example of the practice of this patent with cooling tubes integrated within a microprocessor lid. The ultrasonic image to the right shows the serpentine pattern of the AlSiC encapsulated cooling tube.