Contacts

CPS Vision

CPS Design

CPS Manufacturing

Thermal Management

AlSiC Materials

Information

Directions & Location

CPS Shows & Exhibits

Quickset Injection Molding

Hermetic Packaging

IGBT Baseplates

Power Substrates

Power Module Coolers

Microprocessor Lids

Optoelectronic Housings

Microwave Housings

Structural Composite Components

CPS HybridTech Armor®

AlSiC Heat Sinks

Hybrid Electric Vehicles

Motor Control

Uninterruptible Power Supplies

Flip Chip Lids

Contact Info

Accommodations

Housing Materials

Specifications

AlSiC Hermetic Packages

Flat Packs

Power Header Packages

TO Housings

Aluminum Housings

Machined Housings

AlSiC Hermetic Packages

AlSiC Hermetic Packaging Advantages

40 – 60 % lighter than CuMo & CuW
Lower cost than CuMo & CuW
Thermal expansion matching to direct attachment of GaAs and substrates
High thermal conductivity - (200 W/mK)
Readily available material - Different thickness ; Shape capability
Meets MIL-PRF-38534E

Applications

Military and Aerospace Applications
Shock & Vibration Tolerant Systems
Weight Sensitive Applications

Hermetic Seals

Thermal expansion matched seal - CPS matched seals are produced by the
’Two Step Sealing Process’ for the most robust hermetic seal.
Brazed ceramic feedthrus for high power applications

Download AlSiC Hermetic Package Sheet here