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AlSiC materials for electronic thermal management and packaging solutions AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates |
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CPS is the World Leader in providing AlSiC thermal management materials and electronic packaging designs and products for the microelectronics and power electronics industries. click and download the new AlSiC Flip Chip Lid data sheet 
AlSiC Thermal Management, Microprocessor Lids, Flip Chip Lids, Heat Sinks, Microwave Housings, Optoelectronic Housings, Power Substrates, IGBT Baseplates, Liquid Cold Plates
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